ContactSitemap | Language search
 
HOME > About INPAQ > Technology

Technology

who is who is
Material Technology
Cu FOR Conducting
Ti/W Buffer layer
Epoxy,Polyimide(all photo-resistor) Insulation
Silicon Nitride Dielectric
For Termination:Ni/Sn Termination
Ferrite,Alumia,Silicon,ALN Substrate
Ferrite,Dielectric,glass,Ag Co-firing
Material Technology
Cu FOR Conducting
Ti/W Buffer layer
Epoxy,Polyimide(all photo-resistor) Insulation
Silicon Nitride Dielectric
For Termination:Ni/Sn Termination
Ferrite,Alumia,Silicon,ALN Substrate
Ferrite,Dielectric,glass,Ag Co-firing
contact
Step 1

Mr. Ms. Mrs.



Step 2

請輸入驗證碼